Develop and Etch for Accurate Definition
Back to InnerlayersElectrobrite CC-95 DeveloperPerma-Etch®Cyclo-Etch® Ft-2 ProcessElectrobrite CC-95 Developer
Product Description
Electro-Brite CC-95 Developer Concentrate is a concentrated liquid used to make up and replenish aqueous developing solutions.Electro-Brite CC-95 Developer Concentrate also contains a proprietary stabilizer which acts to maintain a specific pH for extended bath life and an equipment cleaner which continuously cleans the inner surfaces of the developer unit.
Ease of use - CC-95 Developer Concentrate can be made up quickly, eliminating in-house inconsistencies in potassium carbonate concentration and difficulties in completely dissolving solid material.
Economical - CC-95 Developer Concentrate will out perform standard potassium carbonate solutions and require less frequent additions in feed and bleed systems due to its high concentration.
Ease of replenishment - CC-95 Developer Concentrate is ideally suited to operate with pH controlled feed and bleed replenishment systems to achieve steady state processing. CC-95 will require less overall replenishment and give more consistent pH values than non-stabilized systems.
Solution makup
| CC-95 | 1.4 % by volume | |
| Water | 98.6% by volume |
Perma-Etch®*
*United States Patent #4,437,931 #4,437,932Product Description
PERMA-ETCH® is a continuous final etching process for use on printed circuit boards. The PERMA-ETCH® Process is specially formulated for use in conveyorized, spray etching equipment.PERMA-ETCH® Replenisher is a proprietary hydrogen peroxide formulation containing the necessary amounts of stabilizer, catalyst, and inhibitor to maintain an efficient, stable etching process. The patented catalyst or etch promoter provides an etch rate of 1.0 mil (25 microns) per minute.
The etching system is compatible with most resists, results in minimal undercutting (lateral etching), and, in the cast of tin/lead solder plate, exhibits excellent reflow properties due to the effective use of a tin/lead solder inhibitor. The acid nature of the PERMA-ETCH® process permits its use with alkaline soluble resists.
Continuous operation with a constant etch rate is achieved by cycling solution through a simple closed loop regeneration/copper recovery system (See Figure 1). The etched copper is recovered as copper sulfate pentahydrate (CuSO4 · 5H2O).
The long life of the PERMA-ETCH® solution eliminates the need for disposal of spent etchant. The simple chemistry of the bath and the low drag-out rate reduces rinse water waste treatment to simple neutralization.
The PERMA-ETCH® Process can be used with tin/lead solder plated resists without the need for proprietary post etching solder brightening chemicals. This reduces total etching chemical cost by 25% to 50%.
Some important advantages of the PERMA-ETCH® Process are:
- No spent etchant disposal
- 100% utilization of etching chemicals
- No by-product waste
- Compatible with most resists
- Constant etch rate
- Simple control - Free rinsing
- no alkaline/ammonium residues
- Economical
- 90 - 95% recovery of etched copper
Solution makup
| PERMA-ETCH® Make-Up | 90% by volume | |
| PERMA-ETCH® Replenisher | 10% by volume |
Mixing instructions
| 1. | Add the required amount of PERMA-ETCH® Make-Up. |
| 2. | Add the required amount of PERMA-ETCH® Replenisher and mix. |
Operating conditions
| Nominal | Range | ||
| PERMA-ETCH® Replenisher (% v/v) | 10 | 8 - 12 | |
| Sulfuric Acid (% v/v) | 19 | 16 - 22 | |
| Copper | 20 g/L (2.7 oz./gal.) |
4 - 45 g/L (0.5 - 6 oz./gal.) |
|
| Temperature | 53ºC (128ºF) |
49 - 54ºC (120 - 130ºF) |
|
| Dwell Time (sec.) | 90 | 75 - 105 | |
| Etch Rate | 1.0 mil./min. (25 m/min.) |
0.8 - 1.12 mil./min. (20 - 28 m/min.) |
Cyclo-Etch® Ft-2 Process
Product Description
CYCLO-ETCH® FT-2 is an immersion peroxide/sulfuric acid final etching process for use on printed circuit boards. CYCLO-ETCH® FT-2 Concentrate is used in conjunction with 50% w/w hydrogen peroxide to provide the necessary amounts of stabilizer and inhibitor to maintain an efficient, stable etching process. An important feature of the stabilizer system is that the stabilizer is formulated to be consumed at the same rate as the hydrogen peroxide, thus eliminating the problems of stabilizer imbalance.The CYCLO-ETCH® FT-2 Process is adaptable to all sizes of printed circuit board manufacturing facilities. Etching printed circuit boards on a limited batch basis will require a tank of suitable material with provisions for heating, cooling and mild agitation.
Continuous operation, with a constant etch rate is achieved by cycling the etching solution through a simple "closed loop" copper recovery/regeneration system. The "closed loop" consists of a storage facility (tank) for smaller operations, to a complete crystallizer/recovery system for larger installations. In either case, the etched copper is recovered as copper sulfate pentahydrate or electrolytic metallic copper. Copper recovery efficiency is 90 - 95%.
The CYCLO-ETCH® FT-2 Process is compatible with most resists, results in minimal undercutting (lateral etch) and in the case of tin/lead solder plate exhibits excellent reflow properties due to the effective use of a tin/lead solder inhibitor. The acidic nature of the etchant permits its use with alkaline soluble resists.
The infinite life of the CYCLO-ETCH® FT-2 solution eliminates the need for disposing of spent etchant. The simple chemistry of the bath and the low drag out rate reduces rinse water waste treatment to simple pH neutralization.
The CYCLO-ETCH® FT-2 Process offers the following important advantages:
- No spent etchant disposal - 100% utilization of etching chemicals - No by-product waste - Compatible with most resists - Constant etch rate - Simple control and maintenance - Free rinsing - no alkaline/ammonium residues - Economical - 90 - 95% recovery of etched copper
Solution makup
| Deionized Water | 57% by volume | |
| CYCLO-ETCH® FT-2 Make-Up | 33% by volume | |
| 50% w/w Hydrogen Peroxide | 10% by volume | |
| CYCLO-ETCH® FT-2 No Mist | 0.1% by volume |
Operating conditions
| Nominal | Range | |
| 50% w/w Hydrogen Peroxide | 10% by volume | 9 - 11% by volume |
| Sulfuric Acid | 10% by volume | 9 - 11% by volume |
| Copper | 37.5 g/L (5 oz./gal.) |
4 - 56 g/L (0.5 - 7.5 oz/gal) |
| Temperature | 49°C (120°F) |
46 - 52°C (115 - 125°F) |
Bath oeration and maintenance
CYCLO-ETCH® FT-2 Make-Up is used only when compounding a new etching solution. It eliminates the problem of heat evolution in plastic equipment when mixing sulfuric acid with water. It contains the necessary amounts of sulfuric acid, stabilizer, inhibitors and other ingredients so that when it is mixed with the correct quantity of hydrogen peroxide the result is an efficient, stable etching solution. 50% w/w hydrogen peroxide is the active peroxygen etching ingredient weighing 10 pounds per gallon (1.2 kg/L) and the amount used is directly related to the amount of copper etched.After a CYCLO-ETCH® FT-2 bath is made up, further additions of catalysts and stabilizers are made using CYCLO-ETCH® FT-2 Concentrate. It is added in proportion to either hydrogen peroxide or sulfuric acid additions. When adding CYCLO-ETCH® FT-2 Concentrate in proportion to 50% hydrogen peroxide, add 1 gallon of CYCLO-ETCH® FT-2 Concentrate to every 3 gallons on 50% hydrogen peroxide. When adding in proportion to sulfuric acid, add 0.62 gallons of CYCLO-ETCH® FT-2 Concentrate per gallon of concentrated (66°Bé) sulfuric acid.
CYCLO-ETCH® FT-2 No is designed to produce a foam blanket on the bath to keep fumes and mist to a minimum. CYCLO-ETCH® FT-2 No Mist should be added to the bath in increments of .05% by volume to maintain a uniform foam blanket approximately 1 inch thick. Losses of CYCLO-ETCH® FT-2 No Mist are primarily due to drag-out.
The etch rate for a one ounce per square foot (1:4 mil. or 35 micron) board is six to eight minutes and is constant over the entire range of copper concentrations.
