Electrobrite Oxide/Post Dip NPR-501-502
Back to InnerlayersElectro-Brite Copper Treatment 501Electro-Brite Npr 502 Oxide Post Dip ProcessElectro-Brite Npr 502/504 Oxide Post Dip ProcessElectro-Brite Copper Treatment 499Electro-Brite #402-L
Alkaline CleanerElectro-Brite #402-LS Alkaline
CleanerElectro-Brite #403-L Alkaline CleanerElectro-Brite Copper Treatment 501
Product Description
Electro-Brite Copper Treatment 501 is used in the manufacture of printed circuits to produce oxide coatings on copper. Two liquid ingredients, Electro-Brite 501-A and 501-B, are used to make-up and replenish the processing bath thus allowing accurate control of bath components.When used according to these instructions, the 501 Copper Treatment solution promotes the formation of a coating composed of cupric oxide. The coating produced is a brown, fine-grained crystalline structure which improves the strength of the copper to resin bond.
Solution makup
| 501-A | 23% by volume |
| 501-B | 6% by volume* |
| Water | 71% by volume |
*8% 501-B should be used when the oxide process is followed by the NPR-502 reduction process.
Operating conditions
When operated with a reduction step:| Nominal | Range | |
| 501-A | 23% v/v | 20 - 45 % v/v |
| 501-B | 8% v/v | 6 - 14% v/v |
| Temperature | 74°C (165°F) |
66 - 82°C (150 - 180°F) |
| Time | 5 min. | 1 - 7 min. |
| Weight Gain | 0.35 mg/cm2 | 0.20 - 0.60 mg/cm2 |
When operated without a reduction step:
| Nominal | Range | |
| 501-A | 23% v/v | 20 - 35 % v/v |
| 501-B | 6% v/v | 5 - 7% v/v |
| Temperature | 74°C (165°F) |
66 - 82°C (150 - 180°F) |
| Time | 5 min. | 1 - 7 min. |
| Weight Gain | 0.20 mg/cm2 | 0.10 - 0.30 mg/cm2 |
Continuous filtration through a 10 micron polypropylene filter is recommended. This filtration must be properly maintained when using a reduction step following oxide.
Mild solution agitation is recommended to achieve a homogeneous solution and a uniform operating temperature.
Electro-Brite Npr 502 Oxide Post Dip Process
One step process using NPR 502Product Description
The Electro-Brite NPR 502 Oxide Post Dip Process is a uniquely formulated system to be used as a single step post treatment for innerlayers that have been processed in a modified brown or black oxide. The NPR 502 process is designed to eliminate pink ring by reducing the cupric oxide in the actual coating. The reduced coating is resistant to attack by mineral acids.The NPR 502 process, together with a fine-grained cupric oxide such as Electro-Brite 499 or the Electro-Brite 501, promotes a superior resin bond that reduces the tendency for innerlayer wedge voids from mechanical forces or aggressive etch-back chemistries. Additionally, the NPR 502 process improves the chemical resistance of the oxide structure thus reducing attack from acidic pre-plate and plating solutions. Hydrochloric and sulfuric acid solutions show little to no attack on the treated surface.
The NPR 502 process is designed as a single step system. The active ingredient is NPR 502. Optionally, NPR Stabilizer or NPR 504 may be added to reduce consumption of NPR 502 as well as to minimize the effect baking has on the reduced coating.
Solution makup
| NPR 502 | 8% by volume |
| Electro-Brite 501-B | 3% by volume |
| NPR Stabilizer optional (or NPR 504) |
1% by volume (0.45% by volume) |
| Deionized Water | 88% by volume |
Operating conditions
| Nominal | Range | |
| NPR 502 | 8% v/v | 5 - 13% v/v |
| NPR Stabilizer (or NPR 504) |
1% v/v (0.45% v/v) |
0 - 2% v/v (0 - 0.9% v/v) |
| pH | 12.8 | 12.5 - 13.5 |
| Temperature | 24°C (75°F) |
21 - 32°C (70 - 90°F) |
| Dwell Time | 5 min. | 3 - 8 min. |
Mild mechanical agitation is recommended.
Continuous filtration through a 1 micron filter is also recommended.
Important considerations
In order for the NPR 502 Process to totally eliminate pink ring, the process must be used in conjunction with a modified oxide system. The oxide system is designed to give a controlled and predictable growth of the oxide crystal. Ideally the growth (as determined by weight gain) of the oxide should be in the range of 0.30 - 0.50 mg/cm2, optimum being .38 mg/cm2. To insure the oxide process is producing the desired weight gain a weight gain measurement should periodically be performed.Recommended process cycle
| 1. | Electro-Brite 402-L, 402-LS or 403-L Alkaline Cleaner |
| 2. | Rinse |
| 3. | Rinse |
| 4. | CO-BRA ETCH®, Cu Prep or Cu Prep II |
| 5. | Rinse |
| 6. | Rinse |
| 7. | 30% sulfuric acid, 54°C (130°F) |
| 8. | Rinse |
| 9. | Pre-Dip |
| 10. | 501 or 499 Oxide |
| 11. | Rinse |
| 12. | Rinse (adjusted to a pH of 3-4) |
| 13. | NPR 502 Post Dip |
| 14. | Rinse |
| 15. | Rinse |
| 16. | Dry |
Electro-Brite Npr 502/504 Oxide Post Dip Process
Two step process using NPR 502 and NPR 504Product Description
The Electro-Brite NPR 502 Oxide Post Dip Process is a uniquely formulated system to be used as a two step post treatment for innerlayers that have been processed in a modified brown or black oxide. The NPR 502 process is designed to eliminate pink ring by reducing the cupric oxide in the actual coating. The reduced coating is resistant to attack by mineral acids.The NPR 502 process, together with a fine-grained cupric oxide such as Electro-Brite 499 or Electro-Brite 501, promotes a superior resin bond that reduces the tendency for innerlayer wedge voids from mechanical forces or aggressive etch-back chemistries. Additionally, the NPR process improves the chemical resistance of the oxide structure thus reducing attack from acidic pre-plate and plating solutions. Hydrochloric and sulfuric acid solutions show little to no attack on the treated surface.
The NPR 502 process is designed as a two step system. The first step is NPR 502 which modifies the cupric oxide coating to make it more acid resistant. The second step is NPR 504 which protects the modified coating during storage and baking so that the coating remains acid resistant.
Solution makup
| NPR 502 | 8% by volume | |
| Electro-Brite 501-B | 3% by volume | |
| Deionized Water | 89% by volume |
Operating conditions
| Nominal | Range | |
| NPR 502 | 8% v/v | 5 - 13% v/v |
| pH | 12.8 | 12.5 - 13.5 |
| Temperature | 24°C(75°F) | 21 - 32°C(70 - 90°F) |
| Dwell Time | 5 min. | 3 - 8 min. |
Mild mechanical agitation is recommended.
Continuous filtration through a 1 micron filter is also recommended.
Important considerations
In order for the NPR 502 Process to totally eliminate pink ring, the process must be used in conjunction with a modified oxide system. The oxide system is designed to give a controlled and predictable growth of the oxide crystal. Ideally the growth (as determined by weight gain) of the oxide should be in the range of 0.30 - 0.50 mg/cm2, optimum being 0.38 mg/cm2. To insure the oxide process is producing the desired weight gain a weight gain measurement should periodically be performed.Since the NPR 502 process reduces the cupric oxide to copper and cuprous oxide it is important to prevent re-oxidation of the coating. Therefore bake time and temperature following the NPR 502 process should be as low as possible. The following table illustrates the effect of bake time and bake temperature on acid resistance. All samples were treated in one modified oxide process with an initial weight gain of 0.35 mg/cm2 followed by treatment in the NPR 502 and NPR 504 processes.
After the NPR treatment, the samples were baked at different temperatures and time, then weighed. After recording the weights, the samples were immersed for ten minutes in a 17.5% v/v hydrochloric acid solution, dried and reweighed. The weight loss is attributable to oxide attack by acid.
| Bake Temperature | None | 104°C (220°F) | 121°C (250°F) | 138°C (280°F) | |||
| Bake Time (min.) | 30 | 60 | 30 | 60 | 30 | 60 | |
| Oxide Removal (mg/cm2) | 0.09 | 0.13 | 0.18 | 0.16 | 0.17 | 0.13 | 0.18 |
Recommended process cycle
| 1. | Electro-Brite 402-L, 402-LS or 403-L Alkaline Cleaner |
| 2. | Rinse |
| 3. | Rinse |
| 4. | CO-BRA ETCH®, Cu Prep or Cu Prep II |
| 5. | Rinse |
| 6. | Rinse |
| 7. | 30% sulfuric acid, 54°C (130°F) |
| 8. | Rinse |
| 9. | Pre-Dip |
| 10. | 501 or 499 Copper Treatmetn Process |
| 11. | Rinse |
| 12. | Rinse (adjusted to a pH of 3-4) |
| 13. | NPR 502 Post Dip |
| 14. | Rinse |
| 15. | Rinse |
| 16. | NPR 504 |
| 17. | Rinse |
| 18 | Dry |
Electro-Brite Copper Treatment 499
Product Description
Electro-Brite Copper Treatment 499 is used in the manufacture of printed circuits to produce oxide coatings on copper. Two liquid ingredients, Electro-Brite 499-A and 499-B, are used to make-up and replenish the processing bath thus allowing accurate control of bath components.When used according to these instructions, the 499 Copper Treatment solution promotes the formation of a coating composed of cupric oxide. The coating produced is a brown, fine-grained crystalline structure which improves the strength of the copper to resin bond. remains acid resistant.
Solution makup
| Low Temperature | High Temperature | |
| 499-A | 30% by volume | 10% by volume |
| 499-B | 35% by volume* | 25% by volume |
| Deionized Water | 35% by volume | 65% by volume |
*50% 499-B should be used when the oxide process is followed by the NPR-502 reduction process.
Operating conditions
| Nominal | Range | |
| 499-A | 30% v/v | 25 - 40% v/v |
| 499-B | 50% v/v | 40 - 55% v/v |
| Temperature | 71°C (160°F) |
66 - 77°C (150 - 170°F) |
| Time | 5 min. | 1 - 7 min. |
| Weight Gain | 0.35 mg/cm2 | 0.20 - 0.60 mg/cm2 |
When operated at low temperature without a reduction step:
| Nominal | Range | |
| 499-A | 30% v/v | 25 - 40% v/v |
| 499-B | 35% v/v | 30 - 40% v/v |
| Temperature | 71°C (160°F) |
66 - 77°C (150 - 170°F) |
| Time | 5 min. | 1 - 7 min. |
| Weight Gain | 0.20 mg/cm2 | 0.10 - 0.30 mg/cm2 |
When operated at high temperature without a reduction step:
| Nominal | Range |
| 10% v/v | 8 - 15% v/v |
| 25% v/v | 15 - 30% v/v |
| 88°C (190°F) |
82 - 93°C (180 - 200°F) |
| 5 min. | 1 - 7 min. |
| 0.20 mg/cm2 | 0.10 - 0.30 mg/cm2 |
Continuous filtration through a 10 micron polypropylene filter is recommended. This filtration must be properly maintained when using a reduction step following oxide.
Mild solution agitation is recommended to achieve a homogeneous solution and a uniform operating temperature.
Important considerations
Copper Treatment 499 can be operated as either a high-temperature or a low-temperature process. 499-A contains sodium chlorite which acts to oxidize the copper surface. 499-B contains sodium hydroxide to provide a source of alkalinity. 499-B also contains proprietary ingredients to improve the uniformity of the coating.The following guidelines should be considered when setting up the 499 process:
- The desired coating thickness(weight gain) is dependent upon the resin system being used. For standard FR-4 resin systems a higher coating thickness is desired. For polyimide, high Tg FR-4 and other high performance materials a lower thickness is usually required.
- The oxide coating thickness is self limiting. That is, it will not increase thickness beyond a certain point regardless of dwell time. The coating usually forms the majority of its thickness in 3 minutes. The actual point this occurs is dependent upon 499-A concentration, 499-B concentration and bath temperature.
- In general, for a given temperature and 499-B concentration an increase in 499-A concentration will result in a lower oxide weight gain.
- In general, for a given temperature and 499-A concentration an increase in 499-B concentration will result in a higher oxide weight gain.
- Depending upon the concentration of 499-A and 499-B an increase of temperature may either increase or decrease weight gain. Which actually occurs is dependent upon how quickly the coating becomes self limiting.
- The use of a 30% sulfuric acid solution is a very important step to eliminate problems with non-coverage or poor coverage on traces and on edges of pads. It can be used prior to the microetch or after the microetch. Using it after the microetch will reduce the amount of copper that is dragged into the oxide pre-dip.
- The oxide pre-dip is needed to provide an alkaline surface when entering the oxide bath. This helps to improve uniformity.
- Rinsing after the oxide process is extremely important as alkaline residues may affect proper lamination.
Recommended process cycle
| 1. | Electro-Brite 402-L, 402-LS or 403-L Alkaline Cleaner |
| 2. | Rinse |
| 3. | Rinse |
| 4. | CO-BRA ETCH®, Cu Prep or Cu Prep II |
| 5. | Rinse |
| 6. | Rinse |
| 7. | 30% sulfuric acid, 54°C (130°F) |
| 8. | Rinse |
| 9. | Pre-Dip (5% 499-B) |
| 10. | 499 Oxide |
| 11. | Rinse |
| 12. | Rinse (adjusted to a pH of 3-4 when followed by a post dip) |
| 13. | NPR 502 Post Dip (optional) |
| 14. | Rinse |
| 15. | Rinse |
| 17. | Rinse |
| 18 | Dry |
Electro-Brite #402-L Alkaline Cleaner
Product Description
Electro-Brite #402-L Alkaline Cleaner is a liquid concentrate designed for removing grease, dirt and other soils from copper surfaces prior to dry film lamination or oxide treatment in printed wiring board manufacturing.It is designed for immersion applications and can not be used in spray applications. Its liquid form eliminates the need to handle and dissolve dry powder cleaners. #402-L Alkaline Cleaner has an exceptionally long life and is extremely free rinsing.
Solution makup
| #402-L | 25% by volume |
| Water | 75% by volume |
Electro-Brite #402-LS Alkaline Cleaner
Product Description
Electro-Brite #402-LS Alkaline Cleaner is a liquid concentrate designed for removing grease, dirt and other soils from copper surfaces prior to dry film lamination or oxide treatment in printed wiring board manufacturing.It is specially formulated to be low-foaming in high-pressure, automatic spray cleaning machines. Its liquid form eliminates the need to handle and dissolve dry powder cleaners. #402-LS Alkaline Cleaner has an exceptionally long life and is extremely free rinsing.
Solution makup
| #402-LS | 25% by volume |
| Water | 75% by volume |
Electro-Brite #403-L Alkaline Cleaner
Product Description
Electro-Brite #403-L Alkaline Cleaner is a liquid concentrate designed for removing grease, dirt and other soils from copper surfaces prior to dry film lamination or oxide treatment in printed wiring board manufacturing.It is designed for immersion applications and can not be used in spray applications. Its liquid form eliminates the need to handle and dissolve dry powder cleaners. #403-L Alkaline Cleaner has an exceptionally long life and is extremely free rinsing.
Solution makup
| #403-L | 25% by volume |
| Water | 75% by volume |
