Final Finishes

Back to Outerlayers
Electro-Brite M-Tin
Shikoku Glicoat SMD F2-LX
Shikoku Glicoat SMD(F2)
 

Electro-Brite M-Tin

Product Description
Electro-Brite M-Tin is a clear immersion tin designed and formulated to coat a copper substrate or solder deposit with a dense tin deposit. This deposit is readily solderable with a long shelf life.

The tin deposit owes its outstanding corrosion protection to its dense coating and absence of co-deposited organics. M-Tin will clean solder deposits and render the surface active and bright, ensuring good solderability.

It has the benefits of:
-High metal concentration (4 oz./gal.)
-Clear solution even at room temperature
-Dense tin deposit, long shelf life
-Residues are free rinsing
-Very stable solution
Solution makup
M-Tin is used at full strength and therefore requires no mixing or dilution.
Operating conditions
  Nominal Range
Activity 100% 10-120%
Temperature 27°C (80°F) 21-60°C
(70-140°F)
Time 5 min. 1-10 min.
Deposition rate 10 µin/min 3-22 µin/min.
Agitation constant mechanical  
Recommended process cycle
Copper:

1. Electro-Brite Acid Cleaner #4A
2. Rinse
3. Electro-Brite M-Tin
4. Warm Water Rinse
5. Deionized Water Rinse
6. Dry


The treatment of solder plated parts requires no pre-cleaner, except in cases of severe contamination of the surface. In these cases, an alkaline soak cleaner, acid soak cleaner, or a proprietary solder cleaner may be used.

Back to top

SHIKOKU GLICOAT SMD F2-LX
ORGANIC SOLDERABILITY PROTECTANT

Product Description
Shikoku Glicoat SMD F2-LX is an acetic acid based solution containing a substituted imidazole that is designed to produce a thin organic coating on copper while leaving gold plated connectors essentially coating-free. The coating preserves the solderability of the copper surface, while allowing it to be easily soldered without the need for a separate step to remove the coating.

The F2-LX organic solderability protectant (OSP) process provides a thin, uniform, non-tacky film capable of maintaining the solderability of the copper surface through multiple soldering temperature thermal cycles.

The coating is formed through a chemical reaction with the copper surface and, when properly applied, will not affect non-metallic surfaces or contribute to ionic contamination. The F2-LX process leaves gold plated connectors with little or no coating to eliminate the tarnished appearance associated with other OSPs and to allow trouble-free electrical test and functional connections.

The process is easily controlled and is more economical than metallic finishes that provide similar protection.


Stability and Ease of Control

The film thickness is essentially self-limiting, and is easily controlled via the operating parameters.

Both the solution concentration and the coating thickness are checked via a simple method using a UV-Vis. spectrophotometer.

The use of acetic acid in the F2-LX system simplifies control of the pH of the solution. pH changes are reduced by the lesser evaporation rate compared to the formic acid used in other systems. The pH is easily adjusted via a simple titration.

Consumption of the active materials is mostly by drag-out, simplifying control of the chemistry and process cost.

Superior Properties

The F2-LX process forms a coating on copper via a chemical reaction between the copper and the active material in the F2-LX. The coating will not form on non-metallic surfaces and the F2-LX process does not contribute to ionic contamination of the board surface. The F2-LX coating is not tacky and will not contribute to the adhesion of particulate materials to the board surface.

When properly applied, the F2-LX coating is capable of protecting the solderability of copper surfaces through three I.R. soldering cycles and is easily removed by the flux, making it compatible with no-clean soldering processes.

The thin, non-tacky coating does not adversely affect electrical test pins or processes.

The F2-LX coating is chemically bonded to the surface of the copper and will not peel or blister. Intermetallic layers that can contribute to solderability problems are not formed by the F2-LX process.

Nominal Material Characteristics

Appearance Light yellow transparent aqueous solution
pH 3.85 (20°C/ 68°F)
Specific gravity 1.0 (20°C / 68°F)
Acid Acetic acid
Odor Acetic acid (vinegar)

Nominal Deposit Characteristics

Thickness 0.15 - 0.3 m
Color slight pinkish tint
Resistance to thermal cycles solderability maintained through three I.R. soldering cycles

Solution makup
The Glicoat SMD F2-LX material is used at 100 % concentration. The operating sump should be filled to operational level with the Glicoat SMD F2-LX solution as received. No other additions are needed at make up.
Operating conditions
  Nominal Range
F2-LX Concentration 100 % 90 - 110%
Temperature 40°C(104°F) 38 - 42°C(100 - 108°F)
pH 3.85 3.8 - 4.00
Dwell Time 70 sec. 60 - 90 sec
Coating Thickness 0.23 µ 0.15 - 0.3 µ
Equipment Conveyorized application recommended
Application/Agitation Flood chamber with solution spargers
Filtration Continuous, 10 micron polypropylene filters
Replenishment With fresh F2-LX
pH adjustment
Down
Up		  
With acetic acid
Dilution with fresh F2-LX material
Recommended process cycle
Acid Cleaner Soil and Oxide removal (1)
 
Water Rinse 2 stage cascade
Micro-etch 60-100 Micro-inches,
COBRA ETCH® is recommended (2)
 
Water Rinse 2 stage cascade rinse
 
Cold Air Knife To prevent water and acid drag-in (3)
 
Glicoat-SMD (F2-LX) Flood cell: 40°C (104°F) /60 - 90 sec. (4)
Maintain pH between 3.80 and 4.00 and concentration of F2-LX between 90 and 110%
 
Cold Air Knife To reduce drag-out (5)
 
DI Water Rinse To prevent water spots (6)
 
Dryer Hot air knife, 90°C (194°F) / 20 - 60 sec


Notes:
1.Spray acid cleaners, such as Cir Clean-S or acid clean AC15A, are recommended. Flood chamber cleaning is also acceptable.
2. Persulfates and micro etch processes that leave a protective coating require additional steps for residue/coating removal and rinsing.
3. Boards should not be wet when they are introduced into the F2-LX process chamber, a cold air knife is recommended for removal of excess water. Wet boards can cause unwanted dilution of the Glicoat SMD F2-LX and may cause the coating to be visually non-uniform. The visual non-uniformity is caused by the interaction of light with slight variations in coating thickness. These variations do not usually produce functional problems at soldering. Acid drag-in will contaminate the F2-LX solution, lowering the pH and reducing the coating thickness.
4. Flood cells having spargers that provide solution impingement are recommended.
5. Consumption of the F2-LX material is predominantly by drag-out. Failure to return excess solution to the sump will significantly increase operating costs.
6. Water spots can adversely affect board appearance, ionic contamination tests and solderability.


Bath operation and maintenacne
Analysis and Additions

Analysis of the bath concentration, solution pH, and coating thickness should initially be done at least once per shift. As experience with the process and equipment is gained, the frequency of analysis may be adjusted as needed.

To insure accurate readings, the pH meter used to check the F2-LX solution should be calibrated immediately prior to testing the F2-LX bath. Fresh buffers should be used to prevent calibration errors from contamination or evaporation of the buffer.

To measure the "maximum ultraviolet absorbance at about 284.5 nm" with a UV-Vis spectrophotometer, the sample is placed in the instrument and the wavelength is varied around 284.5 nm until the wavelength of maximum absorbance is found. This wavelength is used to make the actual measurement.

Lowering pH, Acetic Acid Additions

The acetic acid controls the pH of the solution.

The pH of the working bath tends to rise over time.

The pH is lowered by adding acetic acid per calculations based on a simple pH titration. Accurate calibration of the pH meter, with fresh buffers, is necessary for accurate pH readings.

Dilution of the acetic acid to 33% (1/3 glacial acetic acid and 2/3 DI water) before adding it to the F2-LX solution is recommended.

Titration

Reagent: 10 % glacial acetic acid (10 ml of glacial acetic acid diluted to 100 ml with DI water in a volumetric flask)

Calibrate the pH meter, per the manufacturer's instructions, using fresh buffers.

Measure 250 ml of the working bath into a 500 ml beaker.

Using a magnetic stirrer at a moderate stir rate (no large vortex), place the pH probe in the solution and allow the pH reading to become stable.

Titrate with 10 % glacial acetic acid to the desired pH (the pH should hold steady for 1 min.).

Calculation:
mL titrant X 1.21 = ml of 33% glacial acetic acid to be added per liter of bath.

Raising pH

If the deposit is too thin due to low pH, 10 - 20% of the bath can be removed and replaced with fresh F2-LX solution. This should be tested in the lab before attempting to adjust the working bath. If 80 ml of working bath plus 20 ml of fresh solution does not produce an acceptable pH, it would indicate major contamination (usually from drag-in) and the working bath should be replaced.

In all cases, the cause of the low pH (e.g. excessive acid additions, drag-in) should be determined and eliminated.

Cleaning Rollers

Crystals of the active material in the F2-LX can form on the rollers in and around the F2-LX treatment chamber.

Cleaning of the rollers in the F2-LX and cold air knife chambers is recommended at least weekly, more often if visible crystals or residues form on the rollers. Cleaning can be accomplished by soaking the rollers in 10% by volume methyl alcohol and wiping them off with a cloth soaked in the cleaning solution. The cleaning solution can be re-used until it begins to re-deposit residues on the rollers. A 5 - 10% by volume acetic acid solution will also serve as an excellent cleaning solution.

An alternative cleaning method is to soak the rollers for 12 - 48 hours in 2 - 5% by volume hydrochloric acid, followed by a fresh water rinse. A second set of rollers is recommended for use while the first set is being cleaned.

Solvent Exposure
Processes that are normally used for ionic contamination testing and removal of misprinted solder paste will remove OSP coatings. Boards exposed to these processes should be re-coated prior to soldering operations.

Crystallization Problems

Very high concentrations of F2-LX and/or a pH higher than 4.1 can cause the F2-LX material to crystallize out of solution. This can usually be reversed by bringing the solution back within the recommended parameters.

It should be noted that, due to the nature of the F2-LX system, pH changes are usually slow and controlling the pH within the normal working range usually only requires occasional acetic acid additions.

Rework

Acid cleaners containing hydrochloric acid will strip the F2-LX coating. If panels need to be reworked through the F2-LX process, they can be re-run without pre-stripping if a cleaner such as Cir-Clean, Cir-Clean S, or acid cleaner AC 15A is in use on the line.

The coating can also be stripped off-line before rework by soaking the part in a solution of 10% methanol / 2% hydrochloric acid (% by volume) at room temperature for about one minute.

Down Time

To reduce the loss of water and acetic acid, lowering the temperature of the F2-LX bath to room temperature and reducing the ventilation is recommended for periods when the process is not in use.

PVA rollers should be stored in water during down time to keep the PVA wet.

Cleaning for Conversion

Most equipment designed to operate with other water based OSPs will also work with F2-LX. A thorough cleaning is needed before the F2-LX solution is introduced into the machine. Contamination with other OSP systems can adversely affect the performance of the F2-LX. Such contamination will usually require replacement of the affected solution.

Please see an Electrochemicals representative for proper cleaning procedure.


Back to top

SHIKOKU GLICOAT SMD(F2)
Organic Solderability Preservatives / Copper Passivation

1. General Information
Glicoat-SMD(F2) forms uniform, very thin and transparent organic coating only on copper surface basically, even in via-holes of Printed Wiring Boards by chemical reaction between the active ingredient, substituted imidazole derivatives, and copper.

Glicoat-SMD(F2) coating has excellent heat-resistance and compatibility with non-clean soldering fluxes and solder pastes, so that it is suitable for PWBs with surface mount technologies as a replacement of HASL and other metal finishings.

The process is easily controlled and is more economical than metallic finishes that provide similar protection.
2. Features
  1. Excellent heat-resistance to stand multiple heat cycles
  2. Excellent compatibility with non-clean soldering fluxes and solder pastes to achieve satisfactory solderability in plated through-holes and spreadability on SMT pads even after multiple heat cycles.
  3. Excellent humidity resistance to prevent copper oxidation for approx. one year after treatment.
  4. Non-sticky, thin and uniform coating on copper basically
  5. Because of chemical reaction, no coating and residues (less ionic contamination) on solder mask, carbon paste and most of metal coating except gold, so that suitable for non-clean process.
  6. Because of chemical reaction, no coating and residues (less ionic contamination) on solder mask, carbon paste and most of metal coating except gold, so that suitable for non-clean process.
  7. Chemically and thermally very moderate process, so that no damage to solder mask like peeling problem by HASL and Ni/Au plating
  8. Less solder ball problem on solder mask in comparison with HASL
  9. Excellent solder joint strength in comparison with especially Ni/Au plating

3. Physical Properties
Appearance: Light blue transparent aqueous solution
pH (20°C): 3.9
Specific gravity (20°C): 1.0
Odor: Weak acetic acid odor
Others: Not hazardous under UN / IATA regulation
4. Process of Treatment
Typical process of whole Glicoat-SMD(F2) treatment and remarks of each process are given as follows.
However, the most critical processes are "3) Microetching", "7) Air knife" and "8) Glicoat-SMD(F2)" to control the solution and the coating consistently, and to give the best performance of Glicoat-SMD(F2) coating itself.
Read carefully before designing the line.

  1. Degreasing
    Highly recommendable especially for print-etch boards due to oil residue by punching, but also for double sided and multilayer boards due to severe copper oxidation by curing for solder mask ink.
  2. Water rinse
    3 cascade rinse
  3. Microetching
    a) Hydrogen peroxide base with no anti-tarnish ingredients contained is recommendable, because of better solder flow-up and solder paste spreadability
    b) 1.5µm thick at least should be microetched to achieve good solderability.
  4. Water rinse
    3 cascade rinse with sufficient fresh water influent to minimize the drag-out
  5. Acid cleaning
    No special chemistry is required, for example 5% sulfuric acid aqueous solution should be enough to clean away residue of SPS base microetching solution. Therefore, it might not be required after hydrogen peroxide base microetching solution.
  6. Water rinse
    3 cascade rinse with sufficient fresh water influent to prevent contamination into Glicoat-SMD(F2) solution.
    It is recommendable to measure pH as a reference of drag-in of pretreatment chemistry.
  7. Air knife
    Blow away water residue completely, especially in through-holes, in order to prevent contamination into Glicoat-SMD(F2) solution.
    No hot air is required.
  8. Glicoat-SMD(F2)
    a) The immersion at 40°C for 60 sec. is typical to obtain the optimum coating thickness between 0.15 and 0.25µm.
    b) pH and concentration of active ingredient should be controlled between 3.80 and 4.00, 90 and 110% respectively, in accordance with the maintenance on page 6.
    c) Add 1% of "Replenish A" to even fresh solution when making-up, and appropriate amount of "Replenish A" when sufficient coating thickness can not be obtained accidentally, in spite of all parameters like concentration, pH, temperature and immersion time within optimum range.
    d) It is highly recommendable to immerse PWBs in the overflowed solution rather than spray, in order to make sure of Glicoat-SMD(F2) solution even in via-holes. To supply the solution by jet nozzle from the bottom is also helpful.
    e) Glicoat-SMD(F2) solution is ready to use without dilution.
    f) Transfer roller should be designed by light weight shaft and gear type roller.
    g) No rubber materials like EPDM must be employed for any parts in Glicoat-SMD(F2) process. It is very difficult to clean the surface, just in case of the crystallization formed.
  9. Squeezing rollers
    a) It is very helpful to minimize the drag-out of Glicoat-SMD(F2) solution, and to form uniform coating as well rather than air knife.
    b) Soft PP or PVAc like sponge is recommendable.
    c) It is not recommendable to employ air knife also, since the roller is always dried so that the crystallization of the active ingredient from the drag-out solution could be easily formed, and make the roller sticky.
    In the worst case, the coating could be peeled off by the sticky roller, and transferred back to PWBs
  10. Water rinse
    a) 3 cascade rinse with sufficient fresh water influent.
    b) D.I. water is recommendable to decrease ionic contamination value on the solder mask.
    c) The pressure of water spray should be moderate, since the coating is still soft.
  11. Drying
    80 - 90°C for 30 sec. with hot air blow to make sure of no moisture in the through-holes.

5. Measurement of Coating Thickness
The coating thickness can be measured by only UV spectrophotometer in accordance with the following method.
With regard to the specification of UV spectrophotometer, double beam type (more expensive) is not necessary at all, and single beam is much enough. However, the band width must be 2 nm, and the absorbance of the peak around 284 nm must be measured.
The wave length of the peak might not be exactly 284 nm, due to the calibration of the instrument. Therefore, UV spectrophotometer which can automatically scan the peak is highly recommendable.  		 wave length vs ABS

The information of the other instruments in details can be referred to "Supplementary Manual"

1) Prepare enough "dissolving solution" by diluting 27.8 gram of 36% conc. hydrochloric acid (HCl) and 100 gram of methyl alcohol (CH3OH) with D.I. water to 1 liter.
   
2) Scrub copper surface of sample boards (bare copper, not etched) thoroughly by using e.g. pretreatment machine for solder mask printing, in order to remove chromate plating first and make sure of chemical reaction with the active ingredient.
   
3) Treat them with Glicoat-SMD(F2) and cut them into appropriate size : S cm2. (e.g. 4×4 cm=16cm2). They should be V-cut before treatment to cut easily by hand.
   
4) Place the cut board in the beaker, pour V ml (e.g. 25 ml) of the dissolving solution, and shake the beaker for 1 minute, in order to dissolve the coating formed on the copper completely.
   
5) After taking out the board of the solution, measure the maximum absorbance (A1) of the peak of the above solution around 284 nm, in comparison with the dissolving solution as a reference.
   
Make sure the crystal cell is dust-free and stainless. Dust and stain would cause error in measurement.
Make sure no bubbles are in the solution.
   
6) The coating thickness (T µm) can be obtained from the following formula.
   
  T = 0.105×A1×V÷S

6. Measurement of Active Ingredient Concentration
As the same manner as the coating thickness, concentration of active ingredient can be measured by UV spectrophotometer in accordance with the following method.
1) Prepare enough dissolving solution by diluting 27.8 gram of 36% conc. hydrochloric acid (HCl) and 100 gram of methyl alcohol (CH3OH) with D.I. water to 1 liter.
   
2) Dilute Glicoat-SMD(F2) sample solution with the dissolving solution in the exact ratio of 1:249. For example, measure precisely 0.2 ml of sample solution using 0.2 ml hole pipette, and put it into 50 ml flask and dilute with the dissolving solution to 50 ml exactly.
   
3) Measure the maximum absorbance (A2) of the peak of the above solution around 284 nm, in comparison with the dissolving solution as a reference.
   
Make sure the crystal cell is dust-free and stainless. Dust and stain would cause error in measurement.
Make sure no bubbles are in the solution.
   
4) Concentration of active ingredient can be obtained from the following formula.
   
  C = 104×A2

7. Measurement of pH
1) It is recommendable to use pH meter designed for Glicoat-SMD(F2) only. Avoid use of the pH meter for both acidic and basic chemistry.
   
2) Calibrate pH meter once a week regularly by 3-point method at pH 6.86, 4.01 and 1.68 at 20°C.
   
3) Must be measured at 20°C after cooling down sample solution.

8. Maintenance
1) pH (20°C) : 3.85 - 4.00
a) pH is the most important factor to maintain the coating thickness consistently, so that it should be measured every day especially before operation. Coating thickness becomes thinner as pH decreases, and thicker as pH increase.
  And In case of too high pH, the crystallization would appear in the solution.
b) Because of drag-in of rinsing water and evaporation of acetic acid, pH tends to increase, therefore make pH lower by adding 5% acetic acid aqueous solution. Do not use concentrated acetic acid.
c) pH of any chemical solution becomes higher at higher temperature, therefore measure pH until the solution is cooled down at 20°C. Just for reference, pH of Glicoat-SMD(F2) at 30 and 40C are 3.95 and 4.00 respectively.
d) Use pH meter in the laboratory, and calibrate it regularly by 3-point method. Automatic pH meter equipped in the line might not be so accurate, since the electrical probe is always in the solution.
   
2) Concentration of active ingredient : 90 - 110%
a) It is recommendable to maintain concentration of active ingredient within the above range as much as possible, in order to keep the thickness within the optimum range consistently.
b) In case of too high concentration, the crystallization would appear in the solution.
3) Thickness of coating : 0.15 - 0.25µm
a) Finally, the thickness of coating have to be controlled between 0.15 - 0.25 µm as correct as possible.
  Less than 0.12µm might be not thick enough to protect copper oxidation during storage and heat cycles. However, more than 0.30µm is too thick to be removed away by soldering flux, then could worsen the solderability.
b) Since the proper thickness is determined by lots of factors like storage, reflow heating, wave soldering, activation of soldering flux and design of PWB, etc., preliminary tests are recommendable.
   
4) Level of solution
  Check the level of solution every day, and keep it as consistent as possible in accordance with Supplementary Manual.
  The quantity consumed is related to drag-out with PWBs, drag-in from pretreatment process and evaporation of water and acetic acid contained in Glicoat-SMD(F2), etc.
  However, the average consumption is approx. 20m2/liter, which is the size of PWB, regardless of the area of copper and solder mask.

5) Replenish A
  Add 1% of "Replenish A" to even fresh solution when making-up, and appropriate amount of "Replenish A" in accordance with the following procedure, when sufficient coating thickness can not be obtained accidentally, in spite of all parameters like concentration, pH, temperature and immersion time within optimum range.
a) Specification
Appearance: Transparent liquid
pH: 7 - 9
Specific gravity: 1.00±0.10 (20C)
b) Dosage
i) Take out 300 ml of Glicoat-SMD(F2) solution exactly of the production line in 300 ml beaker. The depth of the solution is approx. 7.2 cm.
ii) Cool down or warm up the solution at 30C.
iii) Put magnetic stirrer into the beaker, and add 0.5 ml each of "Replenish A" gradually until the magnetic stirrer can not be seen from the top, due to turbid solution.
iv) Dosage of "Replenish A" can be obtained by the following formula. However, if the magnetic stirrer still can be seen even after adding 4.5 ml, it is not necessary to add into the production line.
   
  Dosage of "Replenish A" = (A - 4.5) × B / 300
   
  A : amount of "Replenish A" added into the beaker
  B : amount of Glicoat-SMD(F2) solution in the production line
   
c) How to add
i) Dilute "Replenish A" obtained by the above formula with three times of D.I. water.
ii) Add the diluted "Replenish A" into the bottom tank of the production line with circulating the solution, which should be kept around 40C.
iii) Even if the solution becomes turbid just after dosage, keep on circulating Glicoat-SMD(F2) solution until it will disappear.

9. Precautions
1) Crystallization
  Especially, in case of too high pH (more than 4.1) and concentration of active ingredient (more than 120%), the crystallization tends to appear in the solution.
  It is common to see a little oil-like film on the surface of Glicoat-SMD(F2) at the initial stage, as an indication of crystallization.
  Then, some small white crystals form on the surface. As crystallization advances, the increased crystals stick on the walls of the tank, the transfer rollers, and even PWBs in the worst case.
  Therefore, observe the surface regularly, and take quick action to prevent serious crystallization problem.
   
Trouble shooting
a) Remove crystals on the surface with cloth like oil mat
b) Add D.I. water to lower the concentration of active ingredient around 100%
c) Add 5% acetic acid solution to decrease pH between 3.85 and 4.00, heat up Glicoat-SMD(F2) solution in the tank to 40C, then circulate thoroughly to dissolve crystals.
   
2) Cleaning of squeezing rollers
  The squeezing roller just after Glicoat-SMD(F2) treatment tends to be crystallized, especially when not operating for a long time.
  Therefore, it is highly recommendable to spray the roller with small amount of water after operation to clean away Glicoat-SMD(F2) solution remained.
   
  Use 5% acetic acid solution to clean the crystallization on rollers with cloth.
  However, in case of much crystallization accumulated and hard to remove, dip the roller into "dissolving solution, see 5. 1)" for a while, then wipe off with cloth.
  In addition, it is recommendable to have spare rollers, and change regularly.
   
3) Cleaning of wall
  It is very common to have crystals on the wall of upper tank of Glicoat-SMD(F2), since the over-flowed solution is splashed and only the active ingredient is remained after evaporation of water and acetic acid, etc.
  Therefore, clean away the crystal with brush regularly using over-flowed Glicoat-SMD(F2) solution.
   
4) Evaporation
  For efficient use of Glicoat-SMD(F2), minimize the standby time of the process line as water and acetic acid evaporate while the system is on standby as well as in operation.
  Since Glicoat-SMD(F2) has smell of acetic acid, ventilation is advisable. However, avoid excessive ventilation which may cause over-evaporation and too high concentration easily.
  Therefore, while the system is not in operation, minimize ventilation. Seal gaps of the compartment to decrease evaporation and smell of acetic acid.
   
5) Handling and packing of PWBs
  Glicoat-SMD(F2) coating is reliable enough against moisture from a long term point of view, however could be easily decomposed by water dew and sweat.
  Therefore, PWBs after Glicoat-SMD(F2) treatment should be handled with glove, and packed with plastic bag, if possible with vacuum.

10 Trouble shooting
Trouble Cause Measure
High pH Excessive evaporation of formic acid due to gaps of compartment Seal the gaps to make the compartment airtight
  Excessive evaporation of formic acid due to excessive ventilation Decrease ventilation
  Insufficient replenishment of formic acid Increase replenishment of formic acid
  Too long standby Operate more efficiently
Low pH Excessive replenishment of formic acid Do not add formic acid until Ph recovers. Must use formic acid with 5% dilution
  Drag-in of microetching solution Improve the efficiency of air knife. Increase the influent of rinsing water
High concentration of active ingredient Excessive replenishment of Glicoat-SMD(F2) Decrease replenishment of Glicoat-SMD(F2)
  Concentration by evaporation Replenish deionized water and formic acid
Low concentration ofactive ingredient Insufficient replenishment of Glicoat-SMD(F2) Increase replenishment of Glicoat-SMD(F2)
  Drag-in of rinsing water Prevent drug-in of rinsing water to improve the efficiency of air knife
Insufficient thickness of Glicoat-SMD(F2) coating Improper operating conditions (temperature, time) Refer to the recommended conditions
  Low pH or low concentration of the active ingredient Increase the pH or active ingredient
  Excessive contents with squeezing rollers Decrease pressure and number of contacts
  Microetching solution with anti-tarnish ingredient contained Change microetching solution, or consider acid rinse process
  Anti-tarnish plating like chromate Scrub copper surface by the pretreatment machine before Glicoat-SMD(F2)
Crystallization on the surface of Glicoat-SMD(F2) High pH Replenish formic acid and circulate in a few hours
  High concentration of active ingredient Dilute with deionized water to below 110%
Foreign objectsstick on PWBs Foreign objects transfer from the rollers Clean the roller with weak formic acid to remove
  Glicoat-SMD(F2) contains foreign objects Filter Glicoat-SMD(F2) to remove foreign objects
Insufficient heat resistance Improper thickness of coating Adjust thickness between 0.20 - 0.30 µm
  Improper drying conditions, and moisture is not dried up completely Increase the temperature and time of drying
  Contamination or aging of Glicoat- SMD(F2) Replace with new Glicoat-SMD(F2)
Unevenness in Glicoat-SMD(F2) coating Stained surface of PWBs Enhance microetching to remove stain
  Insufficient thickness of microetching Make sure of 1.5µm at least by analyzing the conditions of microetching
  Insufficient thickness of the coating Adjust thickness between 0.20 - 0.30µm
  Excessive contacts with rollers Use light material for shaft like carbon fiber
  Too high air knife pressure after Glicoat-SMD(F2) Decrease the pressure
  Too high spray pressure of water rinse after Glicoat-SMD(F2) Decrease the pressure
Sudden whitening of Glicoat-SMD(F2) Abnormal drug-in of microetching solution Terminate drag-in of microetching
Abnormal smell of formic acid Insufficient ventilation Open up ventilation duct or install more ducts
  Excessive evaporation of formic acid due to improper sealing of the compartment Make compartment airtight
Excessive decrease of the level of Glicoat-SMD(F2) Excessive drag-out Prevent drag-out to improve air knife after Glicoat-SMD(F2)
  Leak from the tank Repair the tank
  Excessive evaporation Adjust ventilation and avoid long standby
Excessive increase of the level of Glicoat-SMD(F2) Excessive drag-in of rinsing water before Glicoat-SMD(F2) Prevent drag-in of rinsing water before Glicoat-SMD(F2)


11 Properties
1) Solder paste spreadability
a) Specimen
  CEM-3, 1.0 mm thickness
  Test pattern : 0.5 mm width×5 mm long
  Solder paste printing : 0.5 mmf, 0.2 mm thick
  Number of test : 5 pieces each
   
b) IR reflow
  Peak temperature : approx. 240C
  No nitrogen atmosphere
   
c) Solder paste
i) Sn/Pb:63/37, RMA type
ii) Sn/Pb/Bi/Ag:42/42/14/2, Low melting point type
iii) Sn/Pb/Bi, formulation unknown
   
d) Test procedure
i) Glicoat-SMD(F2) treatment
ii) IR reflow (0 or 1 cycle)
iii) Keep sample boards for 5 days under room temperature
iv) Print solder paste
v) IR reflow soldering
vi) Measure the width spread
   
e) Results

i) Sn/Pb:63/37, RMA type
Reflow OSP Width of solder paste spread (µm)
Ave. Max. Min. ø(X)
0 cycle Glicoat-SMD(F2) 3,585 4,209 3,220 246
Glicoat-SMD(E3) 971 1,130 823 74
Competitor E 1,348 1,605 1,185 98
1 cycle+ 5 days Glicoat-SMD(F2) 1,019 1,237 907 73
Glicoat-SMD(E3) 1,022 1,186 909 64
Competitor E 941 1,127 791 64


ii) Sn/Pb/Bi/Ag:42/42/14/2, Low melting point type

Reflow OSP Width of solder paste spread (µm)
Ave. Max. Min. ø(X)
0 cycle Glicoat-SMD(F2) 3,585 4,209 3,220 246
Glicoat-SMD(E3) 971 1,130 823 74
Competitor E 1,348 1,605 1,185 98
1 cycle+ 5 days Glicoat-SMD(F2) 1,019 1,237 907 73
Glicoat-SMD(E3) 1,022 1,186 909 64
Competitor E 941 1,127 791 64

iii) Sn/Pb/Bi, formulation unknown

Reflow OSP Width of solder paste spread (µm)
Ave. Max. Min. ø(X)
0 cycle Glicoat-SMD(F2) 4,941 4,969 4,747 33
Glicoat-SMD(E3) 1,497 1,790 1,206 110
Competitor E 2,916 3,548 2,413 271
1 cycle+ 5 days Glicoat-SMD(F2) 2,285 2,595 1,963 172
Glicoat-SMD(E3) 1,419 1,649 1,251 92
Competitor E 1,176 1,299 1,066 53

2) Surface Insulation Resistance
   
a) Specimen
  IPC A type (copper circuit width : 0.165 mm)
  Substrate : FR-4, 1.6 mm thick
   
b) Aging conditions
  Temp. & Humidity : 85C / 85%RH
  Voltage : DC 50V
  Time : 0 - 1,500 hours
   
c) Test procedure
i) Glicoat-SMD(F2) treatment, 0.15µm
ii) Aging
iii) Keep for one hour under room temperature
iv) Apply 100V for 1 minute and measure resistance
   
d) Results (Ω ×1013)

Time 0 96 253 509 744 1003 1500
Glicoat-SMD(F2) 2.2 1.1 1.2 1.2 1.3 1.1 1.2
Glicoat-SMD(E3) 0.84 0.95 1.0 0.98 1.1 1.0 1.3
Competitor E 7.7 0.97 0.79 0.74 0.98 1.2 1.0




 


Terms of Use | Privacy Policy | Back to top | Electrochemicals Inc Home