Strip Etch Strip
Back to OuterlayersElectro-Brite Resist
Stripper RS-8014QElectro-Brite Resist Stripper
RS-8027QMetal Strippers:
Electro-Brite Sol Strip 150/S1SElectro-Brite Solder
Stripper 818/819 ProcessElectro-Brite Solder Stripper 888-NSElectro-Brite Solder Stripper 890SMEG (Stabilized Metal
Etching Grade 50% W/W Hydrogen Peroxide) Nickelsol nickel and
copper stripping processElectrostrip TL pwb tab tin/lead
stripperFinal etchants: see Cyclo-Etch® and Perma-Etch® under yellow tab "Innerlayer Processing"
Electro-Brite Resist Stripper RS-8014Q
Product Description
Electro-Brite Resist Stripper RS-8014Q is a concentrated aqueous solution formulated to strip aqueous and semi-aqueous dry film resists, liquid photoimageable resists and alkaline soluble, screen printed resists.The RS-8014Q can be used in spray or immersion. Resist Stripper RS-8014Q offers extremely fast stripping times and long life.
Due to the relatively low pH of the working solution, the RS-8014Q will not attack tin or tin/lead etch resists. Resist Stripper RS-8014Q efficiently strips resist while leaving the copper surface clean and free of oxidation.
Solution makeup
| RS-8014Q | 7% by volume |
| Water | Balance |
Note: For spray applications solution make up should include 0.26 mL/L (1mL/gal) of Electro-Brite Defoamer AQ.
Electro-Brite Resist Stripper RS-8027Q
Product Description
Electro-Brite Resist Stripper RS-8027Q is a concentrated aqueous solution formulated to strip aqueous and semi-aqueous dry film resists, liquid photoimageable resists and alkaline soluble, screen printed resists. The RS-8027Q can be used in spray or immersion. Resist Stripper RS-8027Q offers extremely fast stripping times and long life.Due to the relatively low pH of the working solution, the RS-8027Q will not attack tin or tin/lead etch resists. Resist Stripper RS-8027Q efficiently strips resist while leaving the copper surface clean and free of oxidation.
Solution makeup
| RS-8017Q | 7% by volume |
| Water | Balance |
Note: For spray applications solution make up should include 0.26 mL/L (1mL/gal) of Electro-Brite Defoamer AQ.
Electro-Brite Sol Strip 150/S1S
Product Description
Electro-Brite Sol Strip 150/S1S is a highly stabilized hydrogen peroxide based solder stripper, designed to be used in spray and immersion applications to remove tin and tin/lead deposits with minimal attack on the copper substrate.It has the following benefits:
| - | Stabilized to reduce peroxide consumption and provide longer bath life. |
| - | Bath life can be extended by analysis and replenishment of SMEG (50% hydrogen peroxide provided by Electrochemicals). |
| - | Will hold 75 g/L of tin or 150 g/L of tin/lead. |
| - | Low copper attack [less than 5 µin/min (0.125 µ/min) at 32°C (90°F)]. |
Solution makeup
Sol Strip 150/S1S is used at full strength.Operating conditions
| Nominal | Range | |
| SMEG | 10% v/v | 5 - 15% v/v |
| Temperature | 27°C (80°F) |
21 - 32°C (70 - 90°F) |
| DwellTime* (immersion) | 3 minutes | 1 - 5 minutes |
| Dwell Time* (spray) | 1 minute | 20 seconds - 2 minutes |
*Dwell times are based on a nominal thickness of 0.3 mil (7.6 micron) of tin or tin/lead.
Agitation - Mechanical or air for immersion operation.
Cooling - A Teflon® cooling coil is recommended.
Electro-Brite Solder Stripper 818/819 Process
Product Description
The Electro-Brite Solder Stripper 818/819 Process is a two step process specifically engineered for the removal of tin or tin/lead deposits from printed wiring boards.The first step utilizes Electro-Brite Solder Stripper 818 to strip the bulk of the deposit. This step utilizes a nitric acid based solution, 818-A, inhibited to nearly eliminate attack on the base copper. Electro-Brite 818-B is a powdered material added to inhibit attack on copper.
The second step, Electro-Brite Solder Stripper 819, removes the remaining copper-tin intermetallic layer. This peroxide/fluoride step is non-chelated, free rinsing and provides a clean copper surface after stripping.
Solution makeup
Electro-Brite Solder Stripper 818Electro-Brite Solder Stripper 818-A is used full strength.
Electro-Brite Solder Stripper 818-B is added to 818-A at 1.6 oz/gal.
Electro-Brite Solder Stripper 819
Electro-Brite Solder Stripper 819 is used at full strength.
Electro-Brite Solder Stripper 888-NS
Product Description
Electro-Brite Solder Stripper 888-NS is an acidic, ferric nitrate based solder stripper designed for use in printed circuit board fabrication operations for removal of solder and tin deposits from copper substrates. It can be used to ensure a clean, solder free surface for subsequent plating and other processing operations.Solder Stripper 888-NS is designed to be used in immersion or spray applications, and will rapidly strip electroplated tin and solder deposits from copper printed circuit boards.
Solder Stripper 888-NS provides minimal sludge generation during operation and a low copper attack rate.
Solder Stripper 888-NS is easily waste treated and contains no hazardous fluorides, fluoborates, or peroxides. It operates at room temperature for ease of use and reduction of corrosive vapors.
Solution makeup
Solder Stripper 888-NS is used at full strength.Electro-Brite Solder Stripper 890
Product Description
Solder Stripper 890 is an acidic, ferric nitrate based solder stripper designed for use in printed circuit board fabrication operations for removal of tin or solder deposits from copper substrates. It can be used to ensure a clean, solder free surface for subsequent plating and other processing operations.Solder Stripper 890 is designed to be used in immersion or spray applications, and will rapidly strip electroplated tin and solder deposits from copper printed circuit boards.
Solder Stripper 890 provides minimal sludge generation during operation and a low copper attack rate, resulting in a bright copper surface.
Solder Stripper 890 is easily waste treated and contains no hazardous fluorides, fluoborates, or peroxides. It can be operated at room temperature for ease of use and reduction of corrosive vapors.
Solution makeup
Solder Stripper 890 is used at full strength, in a single step operation.SMEG (Stabilized Metal Etching Grade 50% W/W Hydrogen Peroxide)
Product Description
SMEG is a 50% w/w hydrogen peroxide solution designed for the printed circuit board industry. It is used primarily in peroxide/sulfuric microetchants and peroxide based solder strippers.It has the benefits of:
| - | High stability resulting in low consumption |
| - | Low bail out due to high stability |
| - | Uniform etch and consistent topography |
| - | Uniform rate of metal removal |
Safety
SMEG should be stored in the original vented container, in a dry location, out of direct sunlight and away from heat. The vent holes in the cap must be kept open. AVOID CONTAMINATION from any source including metals, dust and organic materials. Contamination may cause rapid decomposition, oxygen generation and high pressures. Allowing any hydrogen peroxide material to dry on clothing or combustible materials may result in a fire.SMEG is a strong oxidizer and causes irritation to eyes, skin, nose and throat. In contact with eyes, SMEG may cause burns. Contact with skin may result in a temporary whitening of the skin and a slight stinging sensation. In all cases of contact, flush skin or eyes with water for 15 minutes and contact a physician. Remove all contaminated clothing immediately.
Consult the Material Safety Data Sheet for safety, health and environmental information.
Nickelsol Process
Product Description
The NICKELSOL process is a hydrogen peroxide-sulfuric acid formulation designed to strip nickel and copper from aluminum, plastic and stainless steel.The NICKELSOL Process can replace nitric acid strippers which cause the evolution of harmful NOx fumes.
The processing solution does not deteriorate to the point where it must be dumped. The copper and nickel dissolved can be recovered in the form of copper sulfate and nickel sulfate respectively.
The NICKELSOL Process does not contain cyanide or chelating agents and treatment of the subsequent rinse water is reduced to simple neutralization and precipitation.
The NICKELSOL Process offers the following advantages:
| - | Does not attack Plastisol coatings |
| - | The bath can be regenerated indefinitely, eliminating frequent dumping and the related waste treatment cost |
| - | The economical recovery of the dissolved nickel and copper is made possible by crystallization |
| - | The system, in most cases, is readily adaptable to most existing automatic, semi-automatic and manual operations |
| - | Simple control and maintenance. |
The NICKELSOL Process may be used in almost any industrial application where the removal of nickel and copper from base surfaces of aluminum, plastic and stainless steel is required. The bath composition can be adjusted to meet the specific operating requirements.
Please call Electrochemicals for additional product details.
Electrostrip TL
Product Description
Electrostrip TL is a concentrated acidic solution used for the electrolytic (anodic) removal of tin and tin-lead alloys from printed circuit board tabs. The concentrate contains inhibitors to retard the attack on copper.Electrostrip TL is supplied as a liquid concentrate.
Solution Makeup
| Electrostrip TL | 40% by volume |
| Deionized Water | Balance |
