Solder Masks and Marking Inks

Liquid Photoimageable Solder Masks and Marking Inks

Electrochemicals is the exclusive representative in the United States for Lackwerke Peters.

Through a strategic partnership, Electrochemicals offers pwb fabricators a complete line of specialty lacquers and marking inks.

The Lackwerke Peters line of specialty polymers provides Electrochemicals’ U.S. based customers a one-stop shop for all pwb fabrication needs. Peters has developed several specialty niche products including peelable solder masks, via hole fillers, plugging paste and heat sink pastes.

The following table summarises the products available.

Photoimageable Solder Mask- double sided/single sided screen print

SD 2467 SM-DG-silk mat, dark green
SD 2467 SG-DG-silk gloss, dark green
SD 2467 XM-DG- extra mat

Note: extra dark green versions available

Photoimageable Solder Masks- other colors for screen print(red, blue, black colorless, white)

Photoimageable Solder Mask-for horizontal HVLP Spray (Argus Equipment)

GL 2467 SM-DG 390, silk mat, dark green
GL 2467 SG-DG, silk glossy, dark green

Photoimageable Solder Mask for TET Halco (Vertical HVLP) Spray

SD 2467 SM-XG (328) extra dark green
This is a special thixotrophic adjustment. This product can also be used for screen printing, particularly on high copper weight foil.

Photoimageable Solder Mask-for curtain coating applications

aqueous alkaline developable

Photoimageable Solder Mask-screen print for flexible circuits

SD 2463 Flex gloss, green
2 pack system; 77% solids; pot life-48 hours

Thermal Cure, screen print solder mask, stencil defined

SD 2462 NB green glossy, no bleed (75% solids)
SD 2462 NB-M, green mat, no bleed (80% solids)
SD 2494 NB-SM white (84% solids) no yellowing

2 pack system; epoxy resin based UV Cure; screen print solder mask; stencil defined

SD 2368 UV-SM-DG, silk mat, dark green
1 pack system
100 % solids; acrylate polymer base

............ continued in column 2

Peelable Solder Mask, screen print, stencil defined

SD 2954 Blue (superior elasticity)

1 pack system; no mixing; oven or IR cure;
98% solids;
peelable before or after wave soldering;
recommended for SMD an multiple pass thermal reflow

SD 2962 P Green
1 pack system, no mixing, oven or IR cure
96% solids
recommended for use in plating solutions
SD 2990 T White
1 pack system, no mixing, oven or IR cure
98% solids
high thixotropic properties ideal for tenting large holes
and covering carbon conductive inks

Via Hole Fill, green

SD 2361, green, via hole filler
1 pack system
99% solids, no shrinkage
no adjustments required
Thermal cure
Eliminates need to use LPI for hole plugging

Marking inks, screen-stencil print, thermal cure

SD 2692 White
SD 2645 Black
SD 2617 Yellow
(orange and red available)
2 pack system, 85% solids-six week pot life

Marking inks, screen-stencil print, UV cure

SD 2594 UV HT, white legend ink
SD 2593 yellow legend ink
1 pack system
100% solids
highly thixotropic

Conductive Inks, screen print, thermal cure

SD 2841 HAL, black carbon conductive ink
high conductivity, 14-20 ohms/sq
hot air levelling resistant

Etch and Plating Resists

RC 2054 Blue, roller and curtain coat
1 pack system, 56% solids
PP 2795 Plugging Paste
Plugging material for small vias of 4 mils and greater in diameter for build-up technology
100% solids, nearly no shrinkage
PP 2795 applied by roller coating system
PP 2795 SD applied via screening
New version for aspect ratios of up to 15:1