US Through hole patent

The US Patent and Trademark Office has issued to Electrochemicals lnc, U.S. Patent no. 6, 037,020:
"ULTRASONIC MIXING OF THROUGH HOLE TREATING COMPOSITIONS."

European Shadow^® patent

The European patent office has issued a very broad patent covering the Shadow^® Process:
"CARBON COMPOSITIONS AND PROCESSES FOR PREPARING A NON-CONDUCTIVE SUBSTRATE FOR ELECTROPLATING." (EP 0698132B1)

Both patents strengthen our position in the global printed wiring board industry. The ultrasonic patent covers the use of graphite based metalization processes and compositions in the manufacture of both through and blind via printed wiring boards.

The European Patent covers all aspects of the Shadow^® process and conductive forms of carbon as well. Fixer Step is also included in the claims.