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New Product Developments at IPC EXPO 2003

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April, 2003

The IPC Printed Circuits Expo^® conference and exhibition was held on March 25-27, 2003 at the Long Beach Convention Center in Long Beach, California

Electrochemicals' expo team

Electrochemicals personnel get ready to greet customers at booth-
With a busy day ahead, members of Electrochemicals get ready for the opening of IPC Printed Circuit Expo 2003. Pictured from left: Chris Hrusovsky, vice-president of sales and technical service; Bill Bowerman, vice-president of technology; Moenes Elias, president of Electrochemicals; and Saad Nakhla, regional technical service engineer.

This year's IPC Printed Circuits Expo^® (its 10th annual) topped the charts with an exceptional program.

For example, in addition to visiting with the leading materials, processes and equipment suppliers, you could take advantage of the many educational opportunities at Expo 2003 by attending one or more of the many tutorials and workshops offered. Leading experts presented useful and up to date information on pwb fabrication, new processes, embedded passives, trouble-shooting and quality control for pwb manufacturing, direct metalization, HDI, laser via formation, and much more.

And, you could attend a world-class technical program. Over 90 original technical papers were presented during the week. Experts from many companies including Motorola, Siemens, Intel, as an example, presented the latest on a variety of disciplines important to the pwb fabricator.

And there was more. IPC Printed Circuits Expo^® 2003 had an embedded passives technology center right on the show floor! Suppliers showcased their materials and processes for this very important and critical technology.

The Innovative Technology Showcase introduced the latest and most novel technologies to the attendees as well. This very successful venue called attendees' attention to novel processes, materials, and equipment that literally has just been or is about to be released to the general market place.

Electrochemicals exhibited in booth 926 discussing new LPI and metalization technologies, also introducing a new OSP designed for lead-free soldering, and a high loading oxide alternative process designed for high performance resin systems. We launched CO-BRA BOND^® SM, a process designed to improve the adhesion of liquid photoimageable soldermasks to the copper surface. This is particularly beneficial when the pwbs are processes through ENIG and Immersion tin solutions.

The show was a tremendous opportunity for all, to:

To meet with as many as 200 suppliers who feature manufacturing equipment, materials, software and services
To identify and begin to develop prospects for future business successes
To get motivated at two FREE keynote addresses
To keep up with the latest industry developments on everything from lead-free to advanced technologies like embedded passives by attending the industry's premier technical conference
To contribute to the development of IPC standards that companies rely on
To sharpen technical skills and knowledge at tutorials, workshops and paper sessions

Thank you for all your past support of Electrochemicals. We hope you were among the many whom we greeted "on the Beach"!

Sincerely,
Michael Carano
Vice-president Marketing and Business Development, Electrochemicals Inc.

For further information please contact Michael Carano at 763-479-2008, ext. 104 or mcarano@electrochemicals.com