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| Electrochemicals' exhibit at IPC EXPO 2004 |
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Expo dates: Februanry 24 - 26Electrochemicals, Inc. is pleased to announce that our company once again participated as an exhibitor at the IPC EXPO.This year's Exhibition and Technical Conference was held at the Anaheim Convention Center. The Exhibition was on February 24-26th, while the technical conference, complete with professional development courses and workshops, was held from Saturday, February 21st through Thursday February 26th, 2004. Attendees had the opportunity to see hundreds of companies focusing on the revolutionary technologies, materials and processes to help fabricators improve yields, reduce costs and jump up the technology curve. Several concurrent technical sessions covered everything from embedded passives, through pwb fabrication issues to solderability improvements. |
For the first time, IPC was co-locating
IPC Printed Circuits EXPO, APEX and the Designers Summit: an opportunity to
find about the entire electronics supply chain. Those who visited our booth learned about all of Electrochemicals' processes and materials for pwb fabrication. At IPC EXPO 2004, we introduced several new technologies including: CO-BRA BOND® HL, a high loading, low copper removal oxide alternative; and Electroless Copper 4000 System, a fully integrated process for the fabrication of high reliability, high aspect ratio printed wiring boards. Technical Papers Electrochemicals also presented three technical papers and several workshops on the latest in process technology. You can obtain complete details of the program by visiting www.ipcprintedcircuitexpo.org for more information. Michael Carano Vice-president Marketing and Business Development, Electrochemicals Inc. |
For further information please contact Michael Carano at 763-479-2008, ext. 104 or mcarano@electrochemicals.com |
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