New! Nickel Sol EN
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May 2007

Nickel Sol EN is a patent pending process designed to remove electroless nickel deposits from circuit boards while preserving the integrity of the underlying copper.

Circuit boards affected by a nickel plating defect are essentially reworked, saving the fabricator from scrapping the pwb.


The NICKELSOL EN Process is an integral part of the Electroless Nickel-Immersion Gold (ENIG) reworking process. NICKELSOL EN is designed to strip electroless nickel from circuit boards that need to be reworked due to faulty ENIG. The process leaves a clean, shiny copper surface enabling re-processing of panels through the ENIG Process.

Operating Conditions
Nickel Sol EN information

Michael Carano Vice-president Marketing and Business Development, Electrochemicals Inc. mcarano@electrochemicals.com


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