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| IPC Inernational Conference on Flexible Printed Circuits |
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June 12 - 13, 2007, Minneapolis, MinnesotaIt is an exciting time for the printed wiring board industry and flexible circuit manufacturing. Flexible Printed Circuits (FPC) are becoming the enabling technology for the electronics interconnect industry.New applications for FPCs are created almost daily. While the opportunities are great, moving into flex is no simple matter. Manufacturers hoping to capitalize on the technology must acquire new skills and manufacturing technologies; this includes new design tools, improved metallization and surface preparation processes, material handling equipment and via formation. |
Industry converged on Minneapolis,
Minnesota on June 12 and 13, 2007. At this conference, they were able to access
a number of experts on FPC manufacturing over two action packed days. On June
12, 2007 participants could attend one or more of several workshops covering a
variety of topics. Electrochemicals presented a 3 hour workshop on “Desmear and Metalization of Flexible Printed Circuits.” And on the 13th, several excellent speakers discussed the latest information on FPC technology in a technical paper session. Michael Carano |
Michael Carano Vice-president Marketing and Business Development, Electrochemicals Inc. mcarano@electrochemicals.com |
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