Electrochemical interaction

- for the best results.

Functionality needed from the PWB....

• Packaging and interconnect for complex devices
• Small, high aspect ratio holes
• Exploiting non conventional materials

... to be effective your process needs

• Good reliable plating
• Plating blind, buried and microvias
• High Yield
• To be environmentally friendly

To all this, Electrochemicals lnc brings ...

• PC-671 High Leveling Copper
  - eliminates plate roughness for high aspect ratio
• PC-667 and PC-606 conventional acid copper
• Airless acid copper
  - improved surface distrbution
• 

• Acid cleaners
  - a wide range of effective and efficient cleaners
• Electro-Brite copper additives
  - bright, level copper applied with efficiency just where needed
• Electrolytic tin
  - Electrochemicals' unique ability to balance the parameters
• 

• PC-626
  - versatile and reliable process for high aspect ratio, high density designs
• PC-695
  - the perfect choice for plating high aspect ratio holes and blind vias
•