| Subject |
Link |
File size |
| Reliability of PTH printed wiring board
manufacture using a graphite-based direct metalization process |
 |
27 kB |
| Enhanced solderability of pwb substrates
using improved organic solderability preservatives |
 |
31 kB |
| Shadow®
technology and flexible circuitry |
 |
7 kB |
| Improved organic solderability
preservatives for mixed metal finishes |
 |
34 kB + images |
| TROUBLE IN YOUR
TANK? Articles on troubleshooting in the PWB process. |
 |
7 kB |
|
|
|
| Articles in Adobe Acrobat pdf format (see text on
right*) |
| Via Hole Filling Technology for high
density, high aspect ratio PWBs |
 |
1.2 MB |
| Built-in Reliability Optimization of the
Desmear and Metalization processes for use on high frequency and lead-free
laminate materials |
 |
0.6 MB |
| Building Strong Bonds Enhancing
interlaminar bond strength for high performance resin systems with an
organo-metallic copper surface treatment process. |
 |
1 MB |
| Back Panels II Reliable metalization of
high aspect ratio through holes |
 |
500 kB |
| Via Hole Filler Lackwerke Peters SD 2361
|
 |
200 kB |
| Glicoat SMD Organic Solderability
Preservatives |
 |
80 kB |
| CO-BRA BOND SM Adhesion promotion for
soldermask & dielectric materials |
 |
1 MB |
| Thermal reliability of lazer ablated
microvias |
 |
600 kB |
| Metalization processes for blind
vias |
 |
300 kB |
| Integrating high density interconnect
microvia technology |
 |
2 MB |
| Use of a chemical fixing agent with
colloidal graphite |
 |
2 MB |
| Hole plugging technology |
 |
100 kB |
| General press releases are
in the NEWS tab in the Company Background section. |
|
|