Product DescriptionShadow®
Conductive Colloid 2 is a slightly alkaline aqueous dispersion of conductive
colloids and proprietary additives used to make through-holes, and other vias,
conductive for subsequent copper electroplating.
Shadow® Conductive Colloid 2 is
environmentally advantageous as compared to other metalization processes. These
benefits include, no metal chelators, less rinse water usage, and ease of
operation.
The Shadow® Conductive Colloid 2
chemistry, and the other products/processes in the
Shadow® direct metalization process, are covered
by several U.S. and foreign patents*.
Solution makup
| Shadow® Conductive Colloid
2 |
31 - 63% v/v |
| Deionized Water |
69 - 37% v/v |
Operating conditions
| |
Nominal |
Range |
| Percent Solids |
3.75% |
2.5 to 5% |
| pH* |
8.8 |
8.0 to 9.2 |
| Temperature |
21.1°C (70°F) |
15.5 - - 26.6°C (60 - 80°F) |
| Contact Time |
30 seconds |
20 - 40 seconds |
| Filtration |
100 micron |
50 - 250 micron |
Recommended process cycle
| Module |
Process Step |
| 1 |
Shadow® Cleaner/Conditioner
III or IV |
| 2 |
Rinse |
| 3 |
Shadow® Conductive Colloid
2 |
| 4 |
Shadow® Fixer |
| 5 |
Rinse |
| 6 |
Dry |
| 7 |
Electro-Brite Cu-Prep II microetch |
| 8 |
Rinse |
| 9 |
Shadow® Antitarnish |
| 10 |
Rinse |
| 11 |
Final Dry |
|
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